Smartphone

Camera module
・Micropearl SP
・Photolec
・Anisotropic Conductive Paste for
 reflow soldering —SAP
Fixture of cover glass
and enclosure
・Photolec B
Fixture of touch panel and FPC board
・Micropearl AU
OLED
・Photolec E
LCD
・Micropearl SP/AU
・Photolec A/S
MEMS sensor
・Micropearl SP/AU/EZ/SLC
・Photolec E
・Epowell GP
・Anisotropic Conductive Paste for
 reflow soldering —SAP
Fixture of touch panel and FPC board
  • MicrosphereMicropearl AU
LCD
  • MicrosphereMicropearl SP/AU
  • ResinPhotolec A/S
Camera module
  • MicrosphereMicropearl SP
  • ResinPhotolec
  • Mounting materialSAP
OLED
  • ResinPhotolec E
Fixture of cover glass
and enclosure
  • ResinPhotolec B
MEMS sensor
  • MicrosphereMicropearl SP/AU/EZ/SLC
  • ResinPhotolec E / Epowell GP
  • Mounting materialSAP
Inside of semiconductor package
  • MicrosphereMicropearl SP/AU/SOL
  • ResinPhotolec E / Epowell GP
  • Mounting materialSAP
Bonding the substrate
  • Mounting materialSAP

Fixture of touch panel and FPC board
Fixture of cover glass and enclosure

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MicrosphereKeep the parallelism, reduce tilt caused by the hardening and shrinkage . Force dispersion effect improves the accuracy of the sensor response

LCD
Liquid Crystal Display (LCD)

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MicrosphereKeep the parallelism, reduce tilt caused by the hardening and shrinkage . Force dispersion effect improves the accuracy of the sensor response

ResinOur company has redeveloped and produced different types of adhesive with various properties, such as adhesive with low exhaust performance, low permeability and high lightproof performance.

Cross section of LCD

Camera module
Camera module

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MicrosphereKeep the parallelism, reduce tilt caused by the hardening and shrinkage . Force dispersion effect improves the accuracy of the sensor response

  • Plastic particle having uniform size distribution Micropearl SP
    Product details

ResinOur company has redeveloped and produced different types of adhesive with various properties, such as adhesive with low exhaust performance , low permeability and high lightproof performance.

MountingCohere substrates without pressure

Fixation of Optical Lens,CMOS Sensor,help to shield light

OLED
Organic EL Display (OLED)

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ResinOur company has redeveloped and produced different types of adhesive with various properties, such as adhesive with low exhaust performance, low permeability and high lightproof performance.

Fixture of cover glass and enclosure
Fixing Of Front Plate/Housing

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ResinOur company has redeveloped and produced different types of adhesive with various properties, such as adhesive with low exhaust performance, low permeability and high lightproof performance.

MEMS sensor

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MicrosphereKeep the parallelism, reduce tilt caused by the hardening and shrinkage . Force dispersion effect improves the accuracy of the sensor response

  • Plastic particle having uniform size distribution Micropearl SP
    Product details
  • Micropearl AU:Plastic core conductive particle
    Product details
  • Micropearl EZ: Low recovery rate and soft uniformed resin particles for gap control
    Product details
  • Micropearl SLC(under development) Silicone type particles
    Product details

ResinOur company has redeveloped and produced different types of adhesive with various properties, such as adhesive with low exhaust performance, low permeability and high lightproof performance.

MountingCohere substrates without pressure

Inside of semiconductor package
In a Semiconductor Package

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MicrosphereKeep the parallelism, reduce tilt caused by the hardening and shrinkage .

ResinOur company has redeveloped and produced different types of adhesive with various properties, such as adhesive with low exhaust performance , low permeability and high lightproof performance.

MountingCohere substrates without pressure

Bonding substrate
Lamination Of Substrates

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MountingCohere substrates without pressure

Parts Type Product name
Surface layer Fixture of cover glass and enclosure Resin UV(B stage)+Moisture curing, Photolec B
Camera module Camera module Microsphere Plastic particle having uniform size distribution Micropearl SP/GS
Resin Photolec(resin product lineup)
Mounting material Anisotropic Conductive Paste for reflow soldering —SAP
Fixture of touch panel and FPC board Microsphere Micropearl AU:Plastic core conductive particle
LCD Cross section of LCD Microsphere Plastic particle having uniform size distribution Micropearl SP
Micropearl AU:Plastic core conductive particle
Resin UV immediate-curing adhesives Photolec A
The sealant for ODF Photolec S
OLED Resin Low moisture permeability adhesive Photolec E
Substrate layer MEMS sensor MEMS sensor Resin Plastic particle having uniform size distribution Micropearl SP
Micropearl AU:Plastic core conductive particle
Micropearl EZ:Low recovery rate and soft uniformed resin particles for gap control
Micropearl SLC (under development): Silicone type particles
Microsphere Low moisture permeability adhesive Photolec E
Thermosetting adhesive with high reliability Epowell GP
Mounting material Anisotropic Conductive Paste for reflow soldering —SAP
Bonding substrate Mounting material Anisotropic Conductive Paste for reflow soldering —SAP
Inside of semiconductor package Microsphere Plastic particle having uniform size distribution Micropearl SP
Micropearl AU:Plastic core conductive particle
Micropearl SOL:Polymer core solder ball
Resin Low moisture permeability adhesive Photolec E
Thermosetting adhesive with high reliability Epowell GP
Mounting material Anisotropic Conductive Paste for reflow soldering —SAP