Micropearl product line up (Plastic Spacer)Micropearl is uniformly particle size distribution with a spherical particles (beads).
Base technology was cultivated with LCD spacer applications

1. Characteristic

Uniformal distribution of plastic particles with unified particle size
In additional to use in automobile parts and optical components for gap control. This producd be used in wide range of applications

  1. Uniform particle size distribution: Coefficient of variation (Cv)≦7%, gap can be control uniformly
  2. Wider range of particle sizes 2 µm to 600 µm.
  3. Excellent in voltage, heat, chemical
  4. Tracking resistance test:600V
  5. It remains stable even at -40 ~ 200 ℃
  6. Product maintains performance stability against many organic solvents
  7. Spacer with adheisve layer
    ▸ Particle with adheisve layer ▸ Resin product categories

2. Particles Product Line up

  Micropearl
SP/GS
Micropearl
EX
Micropearl
KB
Micropearl
EXH
Micropearl
EZ
Micropearl
SLC(Under Development)
Micropearl
AU
Micropearl
SOL
Color transparent(white) transparent(white) Black transparent(white) transparent(white) transparent(white) Yellowish-brown Silvery
Particle Size 3〜600μm 2〜5.5μm 4〜15μm 4.9〜6.9μm 20〜110μm 5〜50μm - -
Hardness
(5hard~1soft)
3 3 3 4 2 1 3 3
Characteristic Uniformal partical size distributions that able to control uniformal sizes. Excellent for voltage, heat and chemical resistance Uniformal partical size distributions that able to control tighter particle size control. Excellent for voltage, heat and chemical resistance Divinylbenzene co-polymer particles with black pigment dispersed. Excellent in blackness and light shielding properties and resistance to exudative Compared to silica particles, this particles are stable with sizes reduction and damage to the substrate. High hardness prevent settlement in the resin caused by heat It is an acrylic co-polymer particle that is very soft and it can absorb vibration and noise. Also it reduces the damage to the substrate. Due to the lower spring back (recovery rate) of the particle, it can be used for softer substates. Silicon polymer based particle . It absorbs vibrations and noise. Lower spring back (recovery rate) of the particles, it can be used for softer substrates Available to coat evenly with diferent type of metals onto plastic particles. Our technology can control hardness of particles and repulsive force. It is a solder coating perticle for semiconductor packageing which use uniform particle size and distribution of soft plastic particle as a core. This technology achieves higher connection reliability, no under filling, narrow spacing and large package.
Simplified diagram Uniform resin particles Micropearl SP/GS Micropearl EX: Particles for high accuracy Micropearl KB: black uniform resin Particles for gap control Micropearl EXH: Hard plastic material uniformed resin particles for gap control Micropearl EZ: Low recovery rate and soft uniformed resin particles for gap control Micropearl SLC(under development) Silicone type particles Micropearl AU: Plastic core conductive particle Micropearl SOL: Polymer core solder ball
Detailed

3. Hardness Series

・Wide range of hardnesses are possible to choose from rigid to flexible
・Wide range of materials are available to keep particle sizes

Micropearl SLC(under development)
Micropearl EZ
Micropearl KB
Micropearl EX
Micropearl SP/GS
Micropearl EXH
Silica particle
(General Products)

4. Wide range of particle size lineup

Wide range of sizes 2μm〜600μm

  • particle size lineup

5. Applications exmaple and effect from using products

1Excellent in gap control for liquid type or ahesive layer

Expected effect
Ensure flatness / parallelism / suppress inclination due to curing shrinkage (improvement of reliability) / prevents optical axis deviation / evenly distributes heat radiation / stress dispersibility sensor sensitivity etc.
ex:Ensure flatness/ suppress inclination due to curing shrinkage (improvement of reliability) / preventsof optical axis deviation / evenly distributes heat radiation / stress dispersibility sensor sensitivity etc.
  • Ensure flatness / parallelism / suppress inclination due to curing shrinkage (improvement of reliability) / prevention of optical axis deviation / uniform heat radiation / stress dispersibility sensor sensitivity etc.
  • Ensure flatness / parallelism / suppress inclination due to curing shrinkage (improvement of reliability) / prevention of optical axis deviation / uniform heat radiation / stress dispersibility sensor sensitivity etc.
  • Ensure flatness / parallelism / suppress inclination due to curing shrinkage (improvement of reliability) / prevention of optical axis deviation / uniform heat radiation / stress dispersibility sensor sensitivity etc.

2Cretae embossing to the surface

Expected effect
Prevent sticking to film / diffuse reflection of light / retention of film thickness.
Anti-blocking agent / anti glare film etc.
  • Anti-blocking agent / anti glare film.
  • Anti-blocking agent / anti glare film.

3Able to produce uniform holes

Expected effect
Light weight / low refraction / dielectric constant / large surface area.
Ex) Porous Material for MLCC / Inverse Opal / Catalyst Carrier / Waveguide / Low-K Material etc.
  • Porous Material for MLCC / Inverse Opal / Catalyst Carrier / Waveguide / Low-K Material etc.

4Using as simulated specimen for equipment performance evaluation, fluid visualization and normalization

Expected effect
Measure the performance of current size/property etc
Ex) Evaluating performance of sensor filter/ design machine / Analytical Instruments standard specimen / Clean room quality assurance / Pseudo cell etc.
  • evaluate th performance of Sensor  Filter/ design machine / Analytical Instruments Standard Specimen / Clean Room Quality Assurance / Pseudo Cell
  • evaluate th performance of Sensor  Filter/ design machine / Analytical Instruments Standard Specimen / Clean Room Quality Assurance / Pseudo Cell

5Able to provide particles with adhesive layer

6. Basic performance properties

Item Test result Form Test method
Compressive fracture strength[kg/mm2] 11 Block JIS K7208 (Cylinder)
Compressive elasticity modulus [mg/mm2] 480 Block JIS K7208 (Cylinder)
Specific gravity 1.19 Plate JIS K7122
Coefficient of thermal expansion[/℃] 9.8×10-5 Plate The average temperature 20~80℃.
Thermal decomposition temp[/℃] 330 Product TGA(In the air)
Volume resistivery[Ωcm] 3.6×1014 Plate JIS K6911(500V)
Permittivity 2.9 Plate JIS K6911(1,000Hz)
Dissipation factor 0.02 Plate JIS K6911(1,000Hz)
Total light transmittance 86.00% Plate JIS K6714(2.3t)
Haze 3.50% Plate JIS K6714(2.3t)
Refractive index 1.57 Plate ASTM(Abbe Refractive index)
Volatile content 0.60% Product JIS(105℃×1H)
Chemical resistance Weight rate of change Form Weight change after the 10th dipping(20℃)
Water 0.50% Plate 2 mmt 1g DI water
NaOH -0.20% Plate 2 mmt 1g 1/10 N
IPA 1.10% Plate 2 mmt 1g 100%
N-MP 0.00% Plate 2 mmt 1g 100%
Acetone 1.00% Plate 2 mmt 1g 100%
HCl 0.40% Plate 2 mmt 1g 1/10 N
Ion content/SP   Form Analysis method
Na ≦2PPM Product Atomic Absorption Spectrometry
K ≦1PPM Product Atomic Absorption Spectrometry
Ca ≦1PPM Product Atomic Absorption Spectrometry
Fe ≦2PPM Product Atomic Absorption Spectrometry
Cl ≦1PPM Product 90℃1Hr、Extra pure water extraction Ion chromatography method