Micropearl product line up (Plastic Spacer)Micropearl is uniformly particle size distribution with a spherical particles (beads).
Base technology was cultivated with LCD spacer applications

Micropearl SOL: Polymer core solder ball

Solder ball with soft and uniformly-sized polymer core

  • Micropearl SOL: Polymer core solder ball
  • Ball size 250µm
    310µm
    500µm
    650µm
    800µm

1. Characteristics

With the unique resin based polymer core, various stress and pressure can be relieved and precise gap control can be achieved

1High reliabilty

  • Underfill less
    Narrow pitch
    Big size PKG
  • High connection reliabilty
    PKG: WLCSP 5.0X5.0mm 0.4mmpitch 121pin

2Keep excellent stand-off and co-planarity

Keep excellent stand-off and flatness
Polymer core can hold a gap to keep an excellent stand-off and flatness

  • <MP-SOL>
    Micropearl SOL: Polymer core solder ball

    The gap is held by the polymer core even after chip mounting

  • Normal solder ball
    Normal solder ball

    Collapse occurs due to package weight while solder reflow process

2. Applications

  • WLCSP/WLCSP
    WLCSP/WLCSP
    [applications]
    ・For mobile
    ・Analog IC (Power,Amplifier,etc)
  • Ceramic BGA/CBGA
    Ceramic BGA/CBGA
    [applications]
    ・Module for Communication and Industry
    ・MCU、CPU
    ・Multi-chip module
  • Ceramic BGA/CBGA
    Packege on Packeage/POP
    [applications]
    ・Communication module for mobile device
    ・Application processor

3. Instructions

It can be mounted with a commercially available solder ball mounter

  • ball mounter
  • Good wettability, self-alignment property
    1st reflow self-alignment property: 1st reflow Cross-sectional picture after reflow
    2nd reflow self-alignment property: 2nd reflow Cross-sectional picture after reflow
    Cross-sectional picture after reflow
  • Voidless
    Voidless: X-ray photograph after reflow
    X-ray photograph after reflow

4. Examples of practical characteristics

It has the same performance as solder bump in strength and electric / thermal characteristics

Ball shear strength

  • Size:310µm n=40
    Ball shear strength Size:310µm n=40
  • Failure mode
      Substrate side Ball size
    SOL SOL Substrate side SOL ball side
    Solder bump Solder bump Substrate side Failure mode Solder bump ball side

Electric resistance

  • Size:310µm n=10
    Electric resistance
    Micropearl SOL 2.87mΩ
    Solder bump 2.88mΩ

Thermal resistance

  • PKG:352pin 35mm PBGA
    Thermal resistance

CatalogProduct catalog

Micropearl SOL:(Polymer core solder ball) Product catalog