GAP control adhesive containing uniform particles

Thermosetting adhesive containing ultra high precision spacer particles

1. Characteristics

1The thickness of the adhesive can be precisely controlled

2Effectively maintain the adhesive insulation

3It is conductive to ensure the consistency of adhesive force

2. Applications

  • Inductors, power supply modules, etc.
    Expected effect: stabilization of inductance
  • Pressure sensor and fixing chip of acceleration sensor
    Expected effect: increase the sensor sensitivity
  • Fixing components in the camera module
    Expected effect: Suppression of camera sensor shake
Inductor,DC-DC Converter
Pressure sensor

3. Comparison with current technology

The advantages of our products in gap control

  • Process reduction (yield improvement)
  • Stable inductance · Reduce tolerance
  • Can also be controlled for narrow intervals
  • Can be used for ferrite cores of various shapes

Comparing to existing construction method

Process

Polishing

1.Polishing

2.Thickness
test

3.Dispense
adhesive

4.Bonding

5.Hardening

Tape

1.Punching
(die cutting)

Manual work

2.Bonding
by tape

Manual work

3.Dispense
adhesive

4.Bonding

5.Hardening

Glass
beads

1.Mixing

Required amount
of adhesive and
particles need
to be mixed
in advance

2.Filling

3.Dispense
adhesive

4.Bonding

5.Hardening

Our products

Unnecessary process

1.Dispense
adhesive

2.Bonding

3.Hardening

4. Particle sizes selection

Average particle diameter[µm] Cv
10±0.1 5% or less
15±0.1
20±0.15
25±0.2
30±0.25
50±0.5
75±0.5
100±1
110±1
Average particle diameter[µm] Cv
40±2 7% or less
50±2.5
60±3
70±3.5
80±4
90±4.5
100±5.5
120±6
130±6.5
140±7.0
150±7.5
160±8.0
170±8.5
180±9.0
190±9.5
200±10