Mounting material

Solder Anisotropic Conductive Paste

Anisotripic Conductive Paste can achieve metal connection with low pressure, low temp. bonding process

  • Solder Anisotropic Conductive Paste

1. Characteristic

  1. Low-profile connection(less than 0.1mmt)
  2. Low pressure bonding(1/2ACF)
  3. Fine pitch(150um)(1/2 Connector)
  4. Achieve voidless connection
  5. Available for Au, Cu electrode
  6. High-speed transmission(USB 3.0)

2. Applications

  • Connector substitute
    Connector substitute
  • Camera Module Connection
    Camera module connection
  • Provision by Panasonic Factory Solutions Co., Ltd.

3. Reliability

  Conditions Results
Adhesive strength 90°peel 20N/cm
Thermal shock -40/85℃ 1000cycle
Moisture resistance 85℃85% 1000h
Electrical insulation 85℃85%15V 1000h
Assembly conditions Temp.:140℃ Pressure:0.8MPa Time:10 second

CatalogProduct catalog

Solder Anisotropic Conductive Paste  Product catalog