Mounting material

Self Assembly Anisotropic Conductive Paste SAP

Anisotropic conductive paste utilizing only by heating.
Achieve metal connection by self-alignment of solder particles.

  • Self Assembly Anisotropic Conductive Paste
  • Self Assembly Anisotropic Conductive Paste Video thumbnail

1. Characteristic

  1. High-speed transmission (USB3.0)
  2. Suitable for large current.
  3. Low-profile connection (less than 0.1mm)
  4. Fine-pitch(150um) (1/2Connector)
  5. Available for Au, Cu electrode
  6. Low temp. profile is available
Features

2. Applications

  • Applications

3. Reliability

  Conditions Results
Adhesive strength 90°peel 48N/cm
Thermal shock -40/85℃ 1000cycle
Moisture resistance 85℃85% 1000h
Electrical insulation 85℃85%15V 1000h
Assembly conditions Temp.:160℃ Time:3min

CatalogProduct catalog

Self Assembly Anisotropic Conductive Paste Product Catalog