Plastic core solder ball Micropearl SOL

Structure

Solder ball with soft and uniformly-sized plastic core

Features

  1. High reliabilty
    • Underfill less
    • Fine pitch
    • Large size PKG
  2. Keep excellent stand-off and co-planarity

Application

WLCSP/WLCSP

  • Application : Analog IC for Mobile
    (Power. Amplifier, etc)

CeramicBGA/CBGA

  • Application : Module for Communication and Industry,MCP,MPU

POP/POP

    Application : Communication module Application processer