Solder Anisotropic Conductive Paste
Epowell AP series

Anisotropic Conductive Paste for
low pressure bonding and metallic junction

Features

  1. Thin Connection(less 0.1mmt)
  2. Low pressure bonding(1/2ACF)
  3. Fine pitch(150um)(1/2Connector)
  4. Voidless without substrate drying
  5. Available for Au, Cu electrode
  6. High-speed transmission(USB3.0)

Application

Connector Substitute

Camera Module

TEG provided by PFSC

Reliability

  Conditions Results
Adhesive strength 90°peel 20N/cm
Thermal shock -40/85℃ 1000cycle
Moisture resistance 85℃85% 1000h
Insulation 85℃85%15V 1000h

Mounting condition

Temp.:140℃
Pressure:0.8MPa
Time:10sec