UV delay-curing adhesives Photolec E

Unique delay curing sealants curable quickly at low temperature for shaded substrates

  • ・Unique UV delay curing system , low temperature and short time curing enables bonding of UV insulating materials.
  • ・Provide various functional adhesives (e.g. transparency and moisture barrier).

Features

Process

Variations

type Feature
Low outgas Low outgas while curing and heating thereafter
Low WVTR Humidity barrier as an edge sealant
high refractive Refractive index 1.6<

Properties

Application

  1. For OLED encapsulation
  2. For Plastic substrates
  3. For Optical bonding