Resin product lineup

1. Resin product lineup

Product series Photolec S Photolec A Photolec E Photolec B
Image The sealant for ODF Photolec S UV immediate-curing adhesives Photolec A Low moisture permeability adhesivePhotolec E UV(B stage)+Moisture curing Photolec B
Cure type UV+heating UV UV+heating UV+moisture
Application The sealant for ODF Fixation of optical components
Protection around the glass substrate
Protection of semiconductor parts
Metal bonding
Sealing agent for OLED device
Tape substitution
Able to use even for small or narrow parts
Color Milky White, Black Clear, Black Clear,Milky white Milky white , Black
Details

2. Applications

  • Smartphone

3. Mechanical Properties

Item Testing method Unit Photolec A Photolec E Photolec S Photolec B Measurement condition
Standard
Grade
High Adhesive
Grade
Black Grade UV
fast cure
Grade
Standard
Grade
Low WVTR
Grade
Standard
Grade
Soft
Grade
Black
Grade
Standard
Grade
Black
Grade
Resin Type Allyl Acryl Epoxy Epoxy (Meth)acryl+epoxy Urethane+acryl
Curing Type UV Curing UV After + Heat Curing UV After + Heat Curing UV Curing
Curing conditions UV1,500mJ/cm2 UV1,500mJ/cm2+80℃×30min UV3000mJ/cm2+120℃×60min UV1,000mJ/cm2Monitored for 24 hours UV3,000mJ/cm2Monitored for 24 hours
Viscosity@25℃ 0.5rpm mPa・s 2,700 - 3,000 383,800 - 602,000 307,800 308,600 293,100 168,000 95,000 E type viscometer(25℃)
1rpm 2,600 - 2,920 335,800 - 442,000 85,300 242,100 276,700 127,600 82,800
5rpm 2,600 13,200 2,900 - 460 236,000 257,300 192,600 249,900 82,900 67,900
10rpm 2,500 12,800 2,800 223,200 450 193,700 247,800 176,500 240,500 65,400 48,200
TI 1rpm/10rpm 1.04 1.03
(5/10rpm)
1.04 1.50 1.02
(5/10rpm)
2.28 1.15 1.37 1.15 1.95 1.72
Tg 24 46 49 211(85) 95 173 95 45 105 21 23 DMA 20mm*0.5*0.3 10Hz, 10℃/min
Transmissivity@500nm 5μm % 100 100 75 7.4 100 65 7.4 6.9 0.02 96 22 The adhesive section between the glass is 5,100, 200μm. The light penetration rate through the adhesive section is measured.
100μm % 100 100 45 6.4 100 49 7 6.4 <0.02 89 9.2
200μm % 100 100 17 5.4 100 36 5.6 5.8 <0.02 83 3.1
Modulus of elasticity DMA25℃ Pa 4.2E+07 1.6E+09 1.6E+09 7.7E+08 2.5E+09 6.5E+09 3.1E+09 2.9E+09 2.1E+09 7.2E+06 4.8E+06 DMA 20mm*0.5*0.3 10Hz, 10℃/min
Shear bonding strength Glass/Glass N/25mm2 >500 >500 >500 214 - - >500 >500 >500 126 72 1mm*25mm2
Dispense area Measure at normal temperature
PC/Glass 1> 119 79 1> - - 1> 1> 1> 104 46
SUS304/Glass 1> 1> 1> 125 - - 1> 1> 1> 73 38
Moisture permeability 60℃90% g/m2-24h 106 43 39 18 30 18 34 71 68 692 655
85℃85% g/m2-24h 385 164 167 41 70 27 138 283 249 1460 1391