Resin product lineup

UV-cured adhesives Photolec A

UV-cured high transparency adhesives without oxygen inhibition

1. Characteristics

  1. Low pollution, Halogen free
  2. Quick UV curing
  3. High transparency and refraction
  4. Suitable for situational manufacturing processes
  5. Low moisture permeation
UV-cured adhesives Photolec A
  1. We have a black version of the resin that is also cured instantly with UV!!
UV-cured black resin

2. Applications

1For optical uses

Fixing Optical Lens, CMOS Sensors
Excluding light at the edge

  • Fixing Optical Lens, CMOS Sensors
    Strong and highly accurate bonding can be achieved

2For protecting glass substrates (we have a blue version of this also)

Protecting base materials when etching them

  • ・Abundant viscosity lineup
    ・Moderate adhesion with glass
    (Easy peeling after processing)
    ・Excellent chemical resistance

3For LCD use

LCD sealing,Moisture proof around the narrow bezel panel,light shielding

For LCD use
  • Wipe-off the liquid crystal
    After injecting the liquid crystal, wipe off extra liquid crystal that is stuck onto the cross section of the panel
  • Dispense Photolec A
  • Permeation of sealant
    • The encapsulant penetrates due to the negative pressure in the panel
    • Penetration level (from cross section), Usually about 0.5 to 1.0 mm
  • Hardening of sealant
    • UV irradiation from cross section
      (UV irradiation from the side may damage the liquid crystal)
    • The amount of light which can reach the liquid crystal interface is insufficient due to over-penetration
    • When the interface is insufficiently cured, it may cause a detecting failure of the liquid crystal display screen
Sealant reacts (cures) with heat, the reaction with heat will increase the adhesion strength to the surface of the glass. We recommend applying heat during the annealing process (recommended conditions: 100℃ for at least 30 minutes)

4Additional merits

This product can protect the electrode of FPC substrates

3. Process

  • UV curing (heating is unnecessary)
    UV curing (heating is unnecessary)
  • After applying our Photolec A on transparent substrates, the curing process begins
    After appluing our Photolec A on transparent substrates, curing process begins

4. Mechanical Properties

Item Unit Standard Grade High Adhesive
Black Grade
Uncured UV irradiation Recommended wavelength nm 300〜380 300〜380 300〜380
Recommended irradiation dose mJ/cm2 1500 1500 1500
Surface hardenability Surface tack-free light intensity mJ/cm2 500 500 100
Impurity Ions Na、K、Ca、Cu、Fe ppm 1> 1> 1>
Cl、Br ppm 20> 20> 20>
Cured Transmission Wavelength 500 nm / 200 μm thick % 100 100 17
Refractive index Cured - 1.546 1.574 -
Chemical Resistance Weight variation Water % 0.74 0.3 -
IPA % 0.00 0.3 -
Acetone % 31.4 13.0 -
Adhesive Glass/Glass N/25mm2 >500 >500 >500
PC/Glass 1> 119 79
SUS304/Glass 1> 1> 1>
Hardness Shore D - 38 77 57
WVTR 60℃、90%RH g/m2・24h 106 43 39

CatalogProduct catalog

Photolec A,E Product catalog