UV-curing adhesives
Photolec A
- Top Page
- Adhesives Product lineup
- UV-curing adhesives Photolec A
UV-curing high transparency adhesives without oxygen inhibition
1. Characteristics
- Low pollution, Halogen free
- Quick UV curing
- High transparency and refraction
- Suitable for situational manufacturing processes
- Low moisture permeation
- Reflow heat resistance (maintains transparency even after reflow)
- We have a black version of the resin that is also cured instantly with UV
2. Applications
1For optical uses
Fixing Optical Lens, CMOS Sensors
Excluding light at the edge
2For protecting glass substrates
Protecting base materials when etching them
3For LCD use
LCD sealing,Moisture proof around the narrow bezel panel,light shielding
-
- After injecting the liquid crystal, wipe off extra liquid crystal that is stuck onto the cross section of the panel
-
- The encapsulant penetrates due to the negative pressure in the panel
- Penetration level (from cross section), Usually about 0.5 to 1.0 mm
-
- UV irradiation from cross section(UV irradiation from the side may damage the liquid crystal)
- The amount of light which can reach the liquid crystal interface is insufficient due to over-penetration
- When the interface is insufficiently cured, it may cause a detecting failure of the liquid crystal display screen
Sealant reacts (cures) with heat, the reaction with heat will increase the adhesion strength to the surface of the glass. We recommend applying heat during the annealing process (recommended conditions: 100℃ for at least 30 minutes)
4Additional merits
This product can protect the electrode of FPC substrates