Smartphone

Camera module
・Micropearl SP
・Photolec
・Anisotropic Conductive Paste for
 reflow soldering
Fixture of cover glass
and enclosure
・Photolec B
Fixture of touch panel and FPC board
・Micropearl AU
OLED
・Photolec E
LCD
・Micropearl SP/AU
・Photolec A/S
MEMS sensor
・Micropearl SP/AU/EZ/SLC
・Photolec E
・GAP control adhesive containing uniform particles
・Anisotropic Conductive Paste for
 reflow soldering
Fixture of touch panel and FPC board
  • MicrosphereMicropearl AU
LCD
  • MicrosphereMicropearl SP/AU
  • AdhesivesPhotolec A/S
Camera module
  • MicrosphereMicropearl SP
  • AdhesivesPhotolec
  • Mounting materialAnisotropic Conductive Paste for reflow soldering
OLED
  • AdhesivesPhotolec E
Fixture of cover glass
and enclosure
  • AdhesivesPhotolec B
MEMS sensor
  • MicrosphereMicropearl SP/AU/EZ/SLC
  • AdhesivesPhotolec E / GAP control adhesive containing uniform particles
  • Mounting materialAnisotropic Conductive Paste for reflow soldering
Inside of semiconductor package
  • MicrosphereMicropearl SP/AU/SOL
  • AdhesivesPhotolec E / GAP control adhesive containing uniform particles
  • Mounting materialAnisotropic Conductive Paste for reflow soldering
Bonding the substrate
  • Mounting material
    Anisotropic Conductive Paste for reflow soldering

Fixture of touch panel and FPC board
Fixture of cover glass and enclosure

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MicrosphereKeep the parallelism, reduce tilt caused by the hardening and shrinkage . Force dispersion effect improves the accuracy of the sensor response

LCD
Liquid Crystal Display (LCD)

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MicrosphereKeep the parallelism, reduce tilt caused by the hardening and shrinkage . Force dispersion effect improves the accuracy of the sensor response

ResinOur company has redeveloped and produced different types of adhesive with various properties, such as adhesive with low exhaust performance, low permeability and high lightproof performance.

Cross section of LCD

Camera module
Camera module

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MicrosphereKeep the parallelism, reduce tilt caused by the hardening and shrinkage . Force dispersion effect improves the accuracy of the sensor response

  • Plastic particle having uniform size distribution Micropearl SP
    Product details

ResinOur company has redeveloped and produced different types of adhesive with various properties, such as adhesive with low exhaust performance , low permeability and high lightproof performance.

MountingCohere substrates without pressure

Fixation of Optical Lens,CMOS Sensor,help to shield light

OLED
Organic EL Display (OLED)

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ResinOur company has redeveloped and produced different types of adhesive with various properties, such as adhesive with low exhaust performance, low permeability and high lightproof performance.

  • UV delayed curing Low moisture permeable adhesive, Photolec E
    Product details

Fixture of cover glass and enclosure
Fixing Of Front Plate/Housing

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ResinOur company has redeveloped and produced different types of adhesive with various properties, such as adhesive with low exhaust performance, low permeability and high lightproof performance.

MEMS sensor

Close

MicrosphereKeep the parallelism, reduce tilt caused by the hardening and shrinkage . Force dispersion effect improves the accuracy of the sensor response

  • Plastic particle having uniform size distribution Micropearl SP
    Product details
  • Micropearl AU:Plastic core Metal coating Particles
    Product details
  • Micropearl EZ: Low recovery rate and soft uniformed resin particles for gap control
    Product details
  • Micropearl SLC(under development) Silicone type particles
    Product details

ResinOur company has redeveloped and produced different types of adhesive with various properties, such as adhesive with low exhaust performance, low permeability and high lightproof performance.

MountingCohere substrates without pressure

Inside of semiconductor package
In a Semiconductor Package

Close

MicrosphereKeep the parallelism, reduce tilt caused by the hardening and shrinkage .

ResinOur company has redeveloped and produced different types of adhesive with various properties, such as adhesive with low exhaust performance , low permeability and high lightproof performance.

MountingCohere substrates without pressure

Bonding substrate
Lamination Of Substrates

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MountingCohere substrates without pressure

Parts Type Product name
Surface layer Fixture of cover glass and enclosure Adhesives UV (B stage) + Moisture curing Adhesive Photolec B
Camera module Camera module Microsphere Plastic particle having uniform size distribution Micropearl SP/GS
Adhesives Photolec(Adhesives Product lineup)
Mounting material Anisotropic Conductive Paste for reflow soldering
Fixture of touch panel and FPC board Microsphere Micropearl AU:Plastic core Metal coating Particles
LCD Cross section of LCD Microsphere Plastic particle having uniform size distribution Micropearl SP
Micropearl AU:Plastic core Metal coating Particles
Adhesives UV-curing adhesives Photolec A
The sealant for ODF Photolec S
OLED Adhesives UV delayed curing Low moisture permeable adhesive, Photolec E
Substrate layer MEMS sensor MEMS sensor Adhesives Plastic particle having uniform size distribution Micropearl SP
Micropearl AU:Plastic core Metal coating Particles
Micropearl EZ:Low recovery rate and soft uniformed resin particles for gap control
Micropearl SLC (under development): Silicone type particles
Microsphere UV delayed curing Low moisture permeable adhesive, Photolec E
GAP control adhesive containing uniform particles
Mounting material Anisotropic Conductive Paste for reflow soldering
Bonding substrate Mounting material Anisotropic Conductive Paste for reflow soldering
Inside of semiconductor package Microsphere Plastic particle having uniform size distribution Micropearl SP
Micropearl AU:Plastic core Metal coating Particles
Micropearl SOL:Polymer core solder ball
Adhesives UV delayed curing Low moisture permeable adhesive, Photolec E
GAP control adhesive containing uniform particles
Mounting material Anisotropic Conductive Paste for reflow soldering