Micropearl product line up (Plastic Spacer)Micropearl is uniformly particle size distribution with a spherical particles (beads).
Base technology was cultivated with LCD spacer applications
Solder ball with soft and uniformly-sized polymer core
| Ball size | 200µm |
|---|---|
| 310µm | |
| 400µm | |
| 450µm | |
| 500µm | |
| 650µm | |
| 800µm |
With the unique resin based polymer core, various stress and pressure can be relieved and precise gap control can be achieved
Maintains excellent stand-off and flatness
Polymer core can maintain the gap to keep an excellent stand-off and flatness
The gap is maintained by the polymer core even after chip mounting
Collapse occurs due to package weight during solder reflow process
It can be mounted with a commercially available solder ball mounter
| 1st reflow |  |
| 2nd reflow |  |
It has the same performance as a solder bump in strength and electric/thermal characteristics
| Substrate side | Ball side | |
|---|---|---|
| SOL |  |
 |
| Solder bump |  |
 |
| Micropearl SOL | 2.87mΩ |
|---|---|
| Solder bump | 2.88mΩ |
