Solder Anisotropic Conductive Paste
Anisotripic Conductive Paste can achieve metal connection with low pressure, low temp. bonding process
1. Characteristic
- Low-profile connection (less than 0.1mmt)
- Low pressure bonding(1/2ACF)
- Fine pitch(150um)(1/2 Connector)
- Achieve voidless connection
- Available for Au, Cu electrode
- High-speed transmission(USB 3.0)
2. Applications
Connector substitute
Camera module connection
3. Reliability
| |
Conditions |
Results |
| Adhesive strength |
90°peel |
20N/cm |
| Thermal shock |
-40/85℃ |
1000cycle |
| Moisture resistance |
85℃85% |
1000h |
| Electrical insulation |
85℃85%15V |
1000h |
| Assembly conditions |
Temp.：140℃ Pressure：0.8MPa Time：10 second |
