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Application
Smartphone
Automobile
Micropearl product
Micropearl product lineup
Micropearl SP/GS: Uniform resin particles
Micropearl EX: Plastic particles for high accuracy size distribution
Micropearl EXH:
Hard plastic material uniformed resin particles for gap control
Micropearl EZ:
Low recovery rate and soft resin particles for gap control
Micropearl SLC (under development): Silicone type particles
Micropearl KB: black uniform resin Particles for gap control
Micropearl AU: Plastic core Metal coating Particles
Micropearl SOL: Polymer core solder ball
GAP control adhesive containing uniform particles
Adhesives Product
Adhesives Product lineup
Sealant for ODF Photolec S
UV-curing adhesives Photolec A
UV delayed curing Low moisture permeable adhesive, Photolec E
UV (B stage) + Moisture curing Adhesive Photolec B
GAP control adhesive containing uniform particles
Mounting material
Mounting material lineup
Solder Anisotropic Conductive Paste
Anisotropic Conductive Paste for reflow soldering
Micropearl AU: Plastic core Metal coating Particles
Micropearl SOL: Polymer core solder ball
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Mounting material
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Mounting material
Anisotropic Conductive Paste for reflow soldering
Anisotropic Conductive Paste for reflow soldering
Anisotropic conductive paste utilizing only by heating.
Under developement
(Samples and data are no longer available.)
HOME
Application
Smartphone
Automotive
Micropearl Products
Uniform distribution of plastic particles with unified particle size
Micropearl SP/GS
Plastic particles for high accuracy size distribution Micropearl EX
Hard plastic material uniform resin particles for gap control Micropearl EXH
Low recovery rate and soft uniform resin particles for gap control Micropearl EZ
Silicone type particles Micropearl SLC(under development)
Black color particles for gap control Micropearl KB
Plastic core Metal coating Particles Micropearl AU
Plastic core solder ball Micropearl SOL
GAP control adhesive containing uniform particles
Adhesives Product
Sealant for ODF Photolec S
UV-curing adhesives
Photolec A
UV delayed curing Low moisture permeable adhesive, Photolec E
UV (B stage) + Moisture curing Adhesive Photolec B
GAP control adhesive containing uniform particles
Mounting material
Solder Anisotropic Conductive Paste SACP
Anisotropic Conductive Paste for reflow soldering
Plastic core Metal coating Particles Micropearl AU
Plastic core solder ball Micropearl SOL
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ISO Certification
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