• Application
  • Smartphone
  • Automobile
• Micropearl product
  • Micropearl product lineup
  • Micropearl SP/GS: Uniform resin particles
  • Micropearl EX: Plastic particles for high accuracy size distribution
  • Micropearl EXH:
    Hard plastic material uniformed resin particles for gap control
  • Micropearl EZ:
    Low recovery rate and soft resin particles for gap control
  • Micropearl SLC (under development): Silicone type particles
  • Micropearl KB: black uniform resin Particles for gap control
  • Micropearl AU: Plastic core Metal coating Particles
  • Micropearl SOL: Polymer core solder ball
  • GAP control adhesive containing uniform particles
• Adhesives Product
  • Adhesives Product lineup
  • Sealant for ODF Photolec S
  • UV-curing adhesives Photolec A
  • UV delayed curing Low moisture permeable adhesive, Photolec E
  • UV (B stage) + Moisture curing Adhesive Photolec B
  • GAP control adhesive containing uniform particles
• Mounting material
  • Mounting material lineup
  • Solder Anisotropic Conductive Paste
  • Anisotropic Conductive Paste for reflow soldering
  • Micropearl AU: Plastic core Metal coating Particles
  • Micropearl SOL: Polymer core solder ball
• Contact us

Mounting material

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• Mounting material
• Anisotropic Conductive Paste for reflow soldering