Resin product lineup

1. Resin product lineup

Product series Photolec S Photolec A Photolec E Photolec B
Image The sealant for ODF Photolec S UV-curing adhesives Photolec A Low moisture permeability adhesivePhotolec E UV(B stage)+Moisture curing Photolec B
Cure type UV delay+heating UV UV+heating UV+moisture
Application The sealant for ODF Fixation of optical components
Protection around the glass substrate
Protection of semiconductor parts
Bonding of UV-opaque materials
Barrier from moisture
Encapsulation materials for OLED
Tape substitution
Able to use even for small or narrow parts
Color Milky White, Black Clear, Black Clear, Dark brown Milky white , Black
Details

2. Applications

  • Smartphone

3. Mechanical Properties

Item Photolec A Photolec E Photolec S Photolec B Measurement
condition
Standard Soft Black Standard Low WVTR Low
temperature
curing
Standard Soft Black Standard High-aspect
Resin Type Allyl Epoxy (Meth)Acryl+Epoxy Urethane+Acryl
Curing Type UV Curing UV After + Heat Curing UV + Heat Curing UV + Moisture
Curing conditions UV1,500mJ/cm2 UV1,500mJ/cm2
+80℃×30min
UV1,500mJ/cm2
+60℃×30min
UV3000mJ/cm2
+120℃×60min
UV1,000mJ/cm2
+25℃50%RH×24h
Viscosity
(mpa・s)
5rpm 10,000 3,600 3,600 250 290,000 7,000 257,300 192,600 249,900 44,000 104,000 E type viscometer
(25℃)
TI 1rpm/
10rpm
1.03 1.03 1.03 1.0 2.1 1.0 1.15 1.37 1.15 1.2 2.7
Tg(℃) 46 24 49 193 173 45 95 45 105 15 18 DMA
20mm*0.5*0.3
10Hz,
10℃/min
Transmission
(%)
500nm/
200μm
100 100 17 100 - 100 5.6 5.8 < 0.02 97 70 500nm
Elastic
modulus
(Pa)
DMA25℃ 1.6E+09 4.2E+07 1.6E+09 3.1E+09 5.4E+09 1.8E+09 3.1E+09 2.9E+09 2.1E+09 6.5E+06 2.1E+07 DMA
20mm*0.5*0.3
10Hz,
10℃/min
WVTR
(g/m2-24h)
60℃90%RH 43 106 39 30 6 33 34 71 68 692 655 300μm

※The above numbers are examples of measured values, not guaranteed values