Adhesives Product lineup
| Product series | Photolec S | Photolec A | Photolec E | Photolec B |
|---|---|---|---|---|
| Image |  |
 |
 |
 |
| Cure type | UV+heating | UV | UV delay+heating | UV+moisture |
| Application | The sealant for ODF |
Fixation of optical components Protection around the glass substrate Protection of semiconductor parts |
Bonding of UV-opaque materials Barrier from moisture Encapsulation materials for OLED |
Tape substitution Able to use even for small or narrow parts |
| Color | Milky White, Black | Clear, Black | Clear, Dark brown | Milky white , Black |
| Details |
| Item | Photolec A | Photolec E | Photolec S | Photolec B | Measurement condition |
||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Standard | Soft | Black | Standard | Low WVTR | Low temperature curing |
Standard | Soft | Black | Standard | High-aspect | |||
| Resin Type | Allyl | Epoxy | (Meth)Acryl+Epoxy | Urethane+Acryl | |||||||||
| Curing Type | UV Curing | UV After + Heat Curing | UV + Heat Curing | UV + Moisture | |||||||||
| Curing conditions | UV1,500mJ/cm2 | UV1,500mJ/cm2 ＋80℃×30min |
UV1,500mJ/cm2 ＋60℃×30min |
UV3000mJ/cm2 ＋120℃×60min |
UV1,000mJ/cm2 ＋25℃50%RH×24ｈ |
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| Viscosity (mpa･s) |
5rpm | 10,000 | 3,600 | 3,600 | 250 | 290,000 | 7,000 | 257,300 | 192,600 | 249,900 | 44,000 | 104,000 | E type viscometer (25℃) |
| TI | 1rpm/ 10rpm |
1.03 | 1.03 | 1.03 | 1.0 | 2.1 | 1.0 | 1.15 | 1.37 | 1.15 | 1.2 | 2.7 | |
| Tg(℃) | 46 | 24 | 49 | 193 | 173 | 45 | 95 | 45 | 105 | 15 | 18 | DMA 20mm*0.5*0.3 10Hz, 10℃/min |
|
| Transmission (%) |
500nm/ 200μm |
100 | 100 | 17 | 100 | - | 100 | 5.6 | 5.8 | < 0.02 | 97 | 70 | 500nm |
| Elastic modulus (Pa) |
DMA25℃ | 1.6E+09 | 4.2E+07 | 1.6E+09 | 3.1E+09 | 5.4E+09 | 1.8E+09 | 3.1E+09 | 2.9E+09 | 2.1E+09 | 6.5E+06 | 2.1E+07 | DMA 20mm*0.5*0.3 10Hz, 10℃/min |
| WVTR (g/m2-24h) |
60℃90%RH | 43 | 106 | 39 | 22 | 6 | 33 | 34 | 71 | 68 | 692 | 655 | 300μｍ |
※The above numbers are examples of measured values, not guaranteed values
