Adhesives Product lineup

UV-curing adhesives Photolec A

UV-curing high transparency adhesives without oxygen inhibition

1. Characteristics

  1. Low pollution, Halogen free
  2. Quick UV curing
  3. High transparency and refraction
  4. Suitable for situational manufacturing processes
  5. Low moisture permeation
  6. Reflow heat resistance (maintains transparency even after reflow)
UV-curing adhesives Photolec A
  1. We have a black version of the resin that is also cured instantly with UV
UV-curing adhesives Photolec A　UV-cured black resin

2. Applications

1For optical uses

Fixing Optical Lens, CMOS Sensors
Excluding light at the edge

  • Fixing Optical Lens, CMOS Sensors
    Strong and highly accurate bonding can be achieved

2For protecting glass substrates

Protecting base materials when etching them

  • ・Abundant viscosity lineup
    ・Moderate adhesion with glass
    （Easy peeling after processing）
    ・Excellent chemical resistance

3For LCD use

LCD sealing,Moisture proof around the narrow bezel panel,light shielding

For LCD use
  • Wipe-off the liquid crystal
    After injecting the liquid crystal, wipe off extra liquid crystal that is stuck onto the cross section of the panel
  • Dispense Photolec A
  • Permeation of sealant
    • The encapsulant penetrates due to the negative pressure in the panel
    • Penetration level (from cross section), Usually about 0.5 to 1.0 mm
  • Hardening of sealant
    • UV irradiation from cross section
      （UV irradiation from the side may damage the liquid crystal）
    • The amount of light which can reach the liquid crystal interface is insufficient due to over-penetration
    • When the interface is insufficiently cured, it may cause a detecting failure of the liquid crystal display screen
Sealant reacts (cures) with heat, the reaction with heat will increase the adhesion strength to the surface of the glass. We recommend applying heat during the annealing process (recommended conditions: 100℃ for at least 30 minutes)

4Additional merits

This product can protect the electrode of FPC substrates

3. Process

  • UV curing (heating is unnecessary)
    UV curing (heating is unnecessary)
  • After applying our Photolec A on transparent substrates, the curing process begins
    After appluing our Photolec A on transparent substrates, curing process begins

4. Mechanical Properties

Item Photolec A Remarks
Standard Soft Black
Resin Type Allyl
Curing Type UV Curing
Curing conditions UV1,500mJ/cm2
Wavelength 300um～380um
Color Colorless Colorless Black
Viscosity（mPa・s） 10,000 3,600 3,600 5rpm　25℃
Ti Value 1.03 1.03 1.03 1rpm/10rpm
Tg（℃） 46 24 49 DMA
Hardness 77 38 57 Shore D
Ion impurity
（ppm）		 Na、K、Ca、Cu、Fe 1 > 1 > 1 >
Cl、Br 20 > 20 > 20 >
Refraction After curing 1.57 1.55 -
Chemical proof Water 0.3 0.7 - Degree of swelling
IPA 0.3 0.0 -
Acetone 13.0 31.4 -
Shear bonding
strength		 Glass/Glass > 500 > 500 > 500 N/25mm2
Measure at normal
temperature
PC/Glass 119.0 1 > 79.00
SUS304/Glass 1 > 1 > 1 >
WVTR（g/m2・24h） 43.00 106.00 39.00 60℃/90%RH
300μm
Storage conditions ０℃～5℃　Shading

※The above numbers are examples of measured values, not guaranteed values