Adhesives Product lineup

UV delayed curing Low moisture permeable adhesive, Photolec E

A low-moisture UV-curing adhesive that adheres opaque substrates at low temperatures in a short time.

1. Characteristics

  1. Curing will start a few minutes after UV irradiation. By heating at low temperature for a short time,
    it cures quickly.
  2. Low Outgas, Moisture-proof
シール剤 フォトレックSシリーズ

2. Temporary curing procees

Dispense→UV Curing→Bonding→Heat Curing

  • UV delay-curing proces

3. Applications


This type is best for sealing materials which are subject to heat, for polarizing parts, and for plastic plates.

2Low moisture permeability

Moisture-proof sealant for OLED Display
【Structure of OLED display (top emission type)】
  • Moisture-proof sealant for OLED Display
  1. This product releases minimal gas generated during curing proccess (UV/heat)
  2. Semiconductor (MEMS, CCD) sealing

Low Outgas

  • UV delay-curing clear adhesive with high viscosity (Photolec E)
    Strong and highly accurate adhesion can be achieved
    ※ With Micropearl SP/GS
  1. Bonding for plastic substrates
  2. Bonding for optical components
  3. Hard disks, surrounding sealants (low moisture permeability), internal adhesive (low outgas)
  4. Semiconductor(MEMS,CCD camera module)

4. Performance parameters

Item Photolec E Remarks
Standard Low WVTR Low temperature curing
Resin Type Epoxy
Curing Type UV After + Heat Curing
Curing conditions UV1,500mJ/cm2
Open time(min.) 10 10 10 25℃
Color Colorless Brown Colorless
Viscosity(mPa・s) 250 290,000 7,000 5rpm 25℃
Ti Value 1.0 2.1 1.0 1rpm/10rpm
Tg(℃) 193 173 45 DMA
WVTR(g/m2・24h) 22 6 33 60℃/90%RH
Outgus(ppm) 7 50 300 GC-MS
Refraction 1.52 - 1.50  
Glass/Glass 3 5 5 Mpa
Storage conditions under 10℃ Shading

※The above numbers are examples of measured values, not guaranteed values