UV (B stage) + Moisture Curing Adhesive
Photolec B

A new type of adhesive that combines the advantages of tape and structural adhesives, and has both high initial strength and high reliability.

1. What is Photolec B?

Small device applications
（smartphone, Wearable device, Earphones　etc.）

Medium and large device applications
（TV, Digital signage, monitor, NotebookPC, Tablet　etc.）

2. Overview

Overview01
Overview02

3. Features

1High initial bonding strength

High initial bonding strength
No fixture required, pressure keeping→improve production efficiency

2Can correspond to narrow side dispensing below 0.5mm

Can correspond to narrow side dispensing below 0.5mm
No glue overflow + high degree of freedom in dispensing→suitable for bonding at narrow borders

3Suitable for bonding of different materials

Suitable for bonding of different materials
Can improve the freedom of material selection

4Maintain softness after fully cured

Maintain softness after fully cured
Can absorb the stress caused by the deformation of the adherend

5Can maintain a certain glue height

Can maintain a certain glue height
Improve the freedom of product design

4.Application

Smart phones

Optical components

Fine parts fixing

Large displays

Automotive display

Mechanical Properties
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