Fine Chemical DivisionFine Chemical Division
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Micro-sized fine particle products and resin products are used as sealing agents, adhesives and solder-based mounting materials
Our products are used in a wide range of fields and for a variety of applications


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SEKISUI CHEMICAL Develops UV + Moisture Curing Adhesive That Simplifies the Electronic Equipment Assembly Process
We have released a video of Photorec B, an adhesive that contributes to drawing fine lines and optimizing the manufacturing process.