접착제 제품 라인업

UV (B Stage) + 습기경화형 접착제 Photolec B

양면 테이프와 접착제의 강점을 융합하여 초기 접착력과 신뢰성을 겸비한 접착제입니다.

1. What is Photolec B?

  1. 소형 디바이스 애플리케이션
    （스마트폰, 웨어러블 디바이스이어폰, 이어폰　등）

  1. 중대형디바이스 애플리케이션
    （TV, 디지털 사이니지, 모니터, 노트북 PC, 태블릿　등）

2. Overview

  • Polyurethane moisture curing
  • 30cc Syringe

3. Features

  • 1High initial bonding strength

    High initial bonding strength
    No fixture required, pressure keeping→improve production efficiency

  • 2Can correspond to narrow side dispensing below 0.5mm

    Can correspond to narrow side dispensing below 0.5mm
    No glue overflow + high degree of freedom in dispensing→suitable for bonding at narrow borders

  • 3Suitable for bonding of different materials

    Suitable for bonding of different materials
    Can improve the freedom of material selection

  • 4Maintain softness after fully cured

    硬化後も柔軟性を持つ
    Can absorb the stress caused by the deformation of the adherend

  • 5Can maintain a certain glue height

    ギャップ制御
    Improve the freedom of product design

4.Application

  • Smart phones

    Smart phones

  • Optical components

    Optical components

  • Fine parts fixing

    Fine parts fixing

  • large displays

    large displays

  • Automotive display

    Automotive display

5.Properties

Item Photolec B Remarks
Standard High-aspect
Resin Type Urethane+Acryl
Curing Type UV+Moisture
Curing conditions Wavelength λ=365～405nm
Irradiation 1000mJ/cm2
Moisture curing 25℃50%×24hr
Viscosity（mPa・s） 44,000 104,000 5rpm　25℃
TI Value 1.2 2.7 1rpm/10rpm
Tg（℃） 15 18 DMA
Shear bonding strength Glass/Glass 55 115 N/25mm2
PC/Glass 85 193
SUS304/Glass 48 73
Storage conditions 25℃ Under 30%RH

※The above numbers are examples of measured values, not guaranteed values