Micropearl product line up (Plastic Spacer)Micropearl is uniformly particle size distribution with a spherical particles (beads).
Base technology was cultivated with LCD spacer applications

Plastic core Metal coating Particles Micropearl AU

Available for several applications for conduction and heat conduction, gap control between electronic devices and base boards etc.

1. What is Micropearl AU?

Uniform resin particles Micropearl SP/GS → Micropearl AU: Plastic core conductive particle

2. Features

1Metal Types Lineup

We have a variety of metal types to choose from to meet your needs.

Metal Types Lineup

2Hardness Control

It is possible to adjust hardness and recovery rate by controlling plastic particles and metal film.

Hardness Control

3Volume resistivity

♦Volume resistance by metal species

Volume resistance by metal species

♦Anti-corrosion treatment effect of Ni coating

Anti-corrosion treatment effect of Ni coating

・Original anti-corrosion treatment achieves high corrosion resistance of Ni coating

※Micropearl AU values are for a resin core of 10 μm
※The above is not a standard value. The above values are not standard values.

4Specific gravity

As it has lower specific gravity than metal powder, it prevents sedimentation in the binder and reduces the weight of the material.

Status specific gravity
Ni Ni metal powder 8.9
Micropearl AU Ni-coated 1.9
Au Au metal powder 19.3
Micropearl AU Au coating 2.2
Cu Cu metal powder 8.9
Micropearl AU with Cu coating 2.1
Ag Ag metal powder 10.5
Micropearl AU with Ag coating 2.7

※Micropearl AU values are for a resin core of 10 μm.
※The above is not a standard value. The above values are not standard values.

3. Application examples

1Connection

  1. Conduction and heat dissipation + Uniform gap
  2. Anisotropic conductivity due to uniform particle size and monodispersity
  3. Improved long-term connection reliability due to the resilience of the plastic core
  4. Weight reduction of materials by low specific gravity
　
  • Example 1) Terminal connection
    Terminal connection
  • Example 2) Conduction path formation
    Conduction path formation
  • 【Example) Terminal connection】
    Terminal connection
　

2Electrode Formation

  1. Formation of ultra small and narrow pitch electrodes with abundant particle size and uniform particle size
  2. Improvement of high frequency characteristics by low profile between boards
  3. Formation of elastic electrodes with flexibility and resilience
  • Example 1)
    Narrow pitch electrode formation
    Narrow pitch electrode formation
  • 【Example of electrode
    formation on a substrate】
    electrode formation on a substrate
  • Example 2)
    Formation of aggregate particle electrodes
    Formation of aggregate particle electrodes

3For thickness control and stress relaxation

  1. Stress dispersion by tilt control
  2. Reduces thermal stress due to the difference in linear expansion between parts
  3. Lower elasticity and higher shear strength of the joint layer
  4. Relaxation of stress in brittle material mounting
  • Example 1) Stress Dispersion by Tilt Control
    Stress Dispersion by Tilt Control
  • 【Tilt control effectl】
    Tilt control effectl
  • Example 2) Lower elasticity and higher shear strength
    Lower elasticity and higher shear strength
  • 【Stress simulation】
    Stress simulation