Adhesives Product lineup

Sealant for ODF, Photolec S

■Sealant for ODF, Photolec S

This adhesive is best for LCD (cured with UV+heating)

1. Characteristic

  1. Due to the sealant quality, there is a low risk of contamination and pollution to the LCD panel
  2. The sealant is easy to handle and excellent to dispense with narrow width
  3. The sealant can also adhere nonmetal substrate
The sealant for ODF, Photolec S

2. Process

  • Process

POTORI Test Viscosity
Unevenness is not observed around the sealant

  • POTORI Test Viscosity

3. Mechanical Properties

Item Photolec S Remarks
Standard Soft
Resin Type (Meth)Acryl+Epoxy
Curing Type UV + Heat Curing
Curing conditions UV 3,000m J /cm2
+120℃×60min
Viscosity（mPa・s） 280,000 230,000 5rpm　25℃
Ti Value 1.15 1.37 1rpm/10rpm
Tg（℃） 95 45 DMA
Shear bonding strength > 500 > 500 Glass/Glass
N/25mm2
WVTR（g/m2・24h） 34 71 60℃/90%RH
300μm
Storage conditions －20℃

※The above numbers are examples of measured values, not guaranteed values

■UV-cured black paste

One-liquid solvent-free UV+heating curing paste

1Features

It can be used for bonding of transparent substrates, shading, etc

  1. Light Shielding
  2. High level of uniformity, minimal presence of foreign materials
  3. High adhesive strength, low moisture permeability
  4. Low contamination (liquid crystal,organic material.etc)
UV-cured black paste

2Applications

  • Adhesion of LCD glass substrates
    LCD cross section
    LCD cross section
  • Adhesion of optical lens
    Lens unit
    Lens unit